|
Cleaner
/ Conditioner
|
|
Cleans PCB holes, removes drilling
debries, finger marks and other
impurities. Prepares hoels for
catalyst by imparting charges
because of unique quaternery molecule
|
|
Microetch
|
Microetch - 18
|
Powdered
salt used for microetching the copper
surface for enhancing the adhesion
of copper deposition
|
|
Pre
Dip
|
Pre
Dip C -100
|
Powdered
salt for preparing the pre activator
dip which acts as a sacrificial
bath
|
|
Catalyst
(Activator)
|
Catalsyt
C - 100
|
Palldium
- Tin colloidal catalyst of fine
particle size. Prepares thru hole
surface for electroelss copper deposition
|
|
Post
Activator
|
Accelerator
PA - 893
|
Post
treats the Thru hole surface after
catalyst for excellent adhesion
of further electroless copper depsotion
|
|
Electroelss
Copper
|
MEC
Cu - 806
|
Room
temperature electroless copper bath,
deposits uniform , void free copper
uniformly
|
|
Antitarnish
|
Antitarnish
Cu - 856
|
Organic
formulation dip for preventing the
copper surface from tarnishing
|
