|
Process
Cycle for Immersion Gold for Electronics
|
Step
|
Process
|
Component
|
Unit
|
Maskeup
conc.
|
Repl
.Conc.
|
PH
|
Time
|
Temp.
|
|
1
|
Acid
Cleaning
|
Acid
Cleaner
# 10
|
Lit
|
300
ml/lit
|
50
ml/ sq.ft
|
--
|
3
to 5
Min
|
45
to 50
Deg C
|
|
2
|
Water
Rinse
|
D.I.Water
|
--
|
--
|
--
|
--
|
1
- 2
Min
|
Room
|
|
3
|
Micro Etch
|
Ammonium
Per Sulphate
|
Gms
|
50
gm /lit
|
Discard
afet 10 g/l Cu
|
--
|
45
to 90 Seconds
|
Room
|
|
Sulphuric
Acid
|
Ml
|
--
|
--
|
--
|
--
|
--
|
|
4
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
5
|
Activation
|
Activator
C - 100
|
Ml
|
25
ml/lit
|
2
to 3 ml /sq.ft
|
--
|
30
to 60 Seconds
|
Room
|
|
6
|
Water
Rinse
|
D.
I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
7
|
Electroless
Nickel
|
EN
826 A
|
Ml
|
100
ml/li
|
20
ml/Sq.ft
|
4.90
- 5.00
|
10
- 15
Min
|
78
- 82
Deg C
|
|
EN
826 B
|
Ml
|
100
ml/lit
|
--
|
--
|
--
|
--
|
|
EN
826 C
|
Ml
|
--
|
20
ml/Sq.ft.
|
--
|
--
|
--
|
|
8
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
9
|
Immersion
Gold
|
Imm
Gold 100
|
Ml
|
600
ml/lit
|
--
|
6.0
- 6.2
|
10
- 15 Mins
|
78
- 85
Deg C
|
|
'R'
Unit
|
Lit
|
--
|
Per
100 gm Au
|
--
|
--
|
--
|
|
10
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
|
|
|