|
Chemicals
for Printed Circuit Boards manufacturing:
- PTH Chemicals
- High throw electrolytic
copper Plating
- Acid Tin Plating
- Nitric Acid base strippers
for Tin-Tin/Lead alloys from copper
- Ammoniacal Etchant replenisher
- Dry Film stripper
- Gold and Gold-Cobalt plating
for connectors
- Immersion gold for Surface
mount Devices
PTH
Process
|
Process
|
Product
|
Function
|
|
Cleaner
/ Conditioner
|
|
Cleans PCB holes, removes drilling
debries, finger marks and other
impurities. Prepares hoels for
catalyst by imparting charges
because of unique quaternery molecule
|
|
Microetch
|
Microetch - 18
|
Powdered
salt used for microetching the copper
surface for enhancing the adhesion
of copper deposition
|
|
Pre
Dip
|
Pre
Dip C -100
|
Powdered
salt for preparing the pre activator
dip which acts as a sacrificial
bath
|
|
Catalyst
(Activator)
|
Catalsyt
C - 100
|
Palldium
- Tin colloidal catalyst of fine
particle size. Prepares thru hole
surface for electroelss copper deposition
|
|
Post
Activator
|
Accelerator
PA - 893
|
Post
treats the Thru hole surface after
catalyst for excellent adhesion
of further electroless copper depsotion
|
|
Electroelss
Copper
|
MEC
Cu - 806
|
Room
temperature electroless copper bath,
deposits uniform , void free copper
uniformly
|
|
Antitarnish
|
Antitarnish
Cu - 856
|
Organic
formulation dip for preventing the
copper surface from tarnishing
|
|
|
|
Electrolytic
Copper / Tin Plating ( Pattern plating )
|
Process
|
Product
|
Function
|
|
Acid
Cleaning
|
|
Non etching acid degreasing soak
cleaner for PCB. Removes dry film
residues and cleans the copper
surface for further copper plating.
|
|
Copper
Brightner
|
High Throw Cu - 844
|
Single
component additive for electrolytic
copper plating bath. Deposit ductile
copper. Enahnce the thrwoing power
and uniform plating.
|
|
Acid
Tin Plating
|
Stanolex 201
|
Bright
uniform tin electrodepostion. Compact
plating, protecting the copper circutary
without overhang
|
|
|
|
Nitric Acid base - Tin / Tin-lead Stripping
|
Process
|
Product
|
Function
|
|
Stripping
(Spray)
|
|
Nitric Acid base stripper desigend
for spray applications. Lower
copper attack. Can operate at
elevated temperature not more
than 48 Deg C.
|
|
Stripping
(Immersion)
|
Fine Strip 1500
|
Nitric
Acid base stripper designed specially
for immersion applications. Non
fuming easy to handle. Best suited
for manual a handling.
|
|
|
|
Ammoniacal
Etching
|
Process
|
Product
|
Function
|
|
Etching
|
|
Ammonical etching solution replenisher.
Maintains the copper content and
speed of operations, pH of solution.
Maintains the solution sludgefree
|
|
|
|
Dry
Film Stripping
|
Process
|
Product
|
Function
|
|
Dryfilm
stripping
|
|
Stripes the dry film by very effective
dissolution and fne breaking.
Suitably designed for fine line
circuits. No residues are left
between the fine tracks. Increse
the speed of operation.
|
|
|
|
Gold
Alloy for Connectors / Circuitary
|
Process
|
Product
|
Function
|
|
Gold
- Cobalt plating
|
|
Deposit hard gold with a very
effective speed of depsotion (
1 Microns in 3:30 mins). Hard
depsoit with low contact resistance.
Suitable for barrel applications
in case of phosphor bronze pin
connectors.
|
|
|
|
Process
Cycle for Immersion Gold for Electronics
|
Step
|
Process
|
Component
|
Unit
|
Maskeup
conc.
|
Repl
.Conc.
|
PH
|
Time
|
Temp.
|
|
1
|
Acid
Cleaning
|
Acid
Cleaner
# 10
|
Lit
|
300
ml/lit
|
50
ml/ sq.ft
|
--
|
3
to 5
Min
|
45
to 50
Deg C
|
|
2
|
Water
Rinse
|
D.I.Water
|
--
|
--
|
--
|
--
|
1
- 2
Min
|
Room
|
|
3
|
Micro Etch
|
Ammonium
Per Sulphate
|
Gms
|
50
gm /lit
|
Discard
afet 10 g/l Cu
|
--
|
45
to 90 Seconds
|
Room
|
|
Sulphuric
Acid
|
Ml
|
--
|
--
|
--
|
--
|
--
|
|
4
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
5
|
Activation
|
Activator
C - 100
|
Ml
|
25
ml/lit
|
2
to 3 ml /sq.ft
|
--
|
30
to 60 Seconds
|
Room
|
|
6
|
Water
Rinse
|
D.
I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
7
|
Electroless
Nickel
|
EN
826 A
|
Ml
|
100
ml/li
|
20
ml/Sq.ft
|
4.90
- 5.00
|
10
- 15
Min
|
78
- 82
Deg C
|
|
EN
826 B
|
Ml
|
100
ml/lit
|
--
|
--
|
--
|
--
|
|
EN
826 C
|
Ml
|
--
|
20
ml/Sq.ft.
|
--
|
--
|
--
|
|
8
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
9
|
Immersion
Gold
|
Imm
Gold 100
|
Ml
|
600
ml/lit
|
--
|
6.0
- 6.2
|
10
- 15 Mins
|
78
- 85
Deg C
|
|
'R'
Unit
|
Lit
|
--
|
Per
100 gm Au
|
--
|
--
|
--
|
|
10
|
Water
Rinse
|
D.I.Water
|
|
--
|
--
|
--
|
--
|
--
|
|
|
|
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